The active devices will be integrated on Ligentec's low-loss silicon nitride platform, through the development of an evanescent coupling interface for heterogeneous integration.
In a first stage, devices will be prototyped separately, where they benefit from low propagation losses for the external cavities.
In the next stage, all optimized devices are interconnected on the same platform.
Ligentec's technology offers rapid prototyping within the project, while enabling scaling to higher volumes on 200-mm wafers.